JPH0749790Y2 - 半導体ウェーハの洗浄装置 - Google Patents
半導体ウェーハの洗浄装置Info
- Publication number
- JPH0749790Y2 JPH0749790Y2 JP1989012041U JP1204189U JPH0749790Y2 JP H0749790 Y2 JPH0749790 Y2 JP H0749790Y2 JP 1989012041 U JP1989012041 U JP 1989012041U JP 1204189 U JP1204189 U JP 1204189U JP H0749790 Y2 JPH0749790 Y2 JP H0749790Y2
- Authority
- JP
- Japan
- Prior art keywords
- cleaning
- semiconductor wafer
- solution
- tank
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004140 cleaning Methods 0.000 title claims description 49
- 239000004065 semiconductor Substances 0.000 title claims description 15
- 239000000126 substance Substances 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 11
- 239000007788 liquid Substances 0.000 description 27
- 239000000243 solution Substances 0.000 description 17
- 235000012431 wafers Nutrition 0.000 description 11
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 6
- 235000011114 ammonium hydroxide Nutrition 0.000 description 6
- QOSATHPSBFQAML-UHFFFAOYSA-N hydrogen peroxide;hydrate Chemical compound O.OO QOSATHPSBFQAML-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000005502 peroxidation Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989012041U JPH0749790Y2 (ja) | 1989-02-02 | 1989-02-02 | 半導体ウェーハの洗浄装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989012041U JPH0749790Y2 (ja) | 1989-02-02 | 1989-02-02 | 半導体ウェーハの洗浄装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02102725U JPH02102725U (en]) | 1990-08-15 |
JPH0749790Y2 true JPH0749790Y2 (ja) | 1995-11-13 |
Family
ID=31221128
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989012041U Expired - Lifetime JPH0749790Y2 (ja) | 1989-02-02 | 1989-02-02 | 半導体ウェーハの洗浄装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0749790Y2 (en]) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109673107A (zh) * | 2018-12-13 | 2019-04-23 | 重庆方正高密电子有限公司 | 褪洗设备和生产线 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59215729A (ja) * | 1983-05-21 | 1984-12-05 | Ulvac Corp | 半導体もしくは磁気記録媒体等の基板の洗浄装置 |
JPS63128186A (ja) * | 1986-11-17 | 1988-05-31 | Hitachi Ltd | 湿式エツチング装置 |
JPS63272040A (ja) * | 1987-04-30 | 1988-11-09 | Fujitsu Ltd | 循環濾過洗浄装置 |
-
1989
- 1989-02-02 JP JP1989012041U patent/JPH0749790Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH02102725U (en]) | 1990-08-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7784998B2 (en) | Method for liquid mixing supply | |
US5415191A (en) | Arrangement for cleaning semiconductor wafers using mixer | |
US20030227821A1 (en) | Chemical supply apparatus | |
JP6635459B1 (ja) | オゾン水の製造法 | |
JP2009141332A (ja) | オゾン水混合液供給装置及び方法、並びにこれを具備する基板処理装置 | |
TWI402901B (zh) | Liquid mixture method and liquid medicine mixing device | |
CN102030306A (zh) | 清洗方法、清洗系统以及制造微结构的方法 | |
JP2002086084A (ja) | 基板洗浄方法及び基板洗浄装置 | |
JP7099172B2 (ja) | 電子部品用洗浄水製造システム及び電子部品用洗浄水製造システムの運転方法 | |
KR100808237B1 (ko) | 전이 유동에 의한 물체의 표면처리방법 | |
US20110079247A1 (en) | Solution preparation apparatus and method for treating individual semiconductor workpiece | |
JP2019153610A (ja) | 基板処理装置、基板処理装置における処理液排出方法、基板処理装置における処理液交換方法、基板処理装置における基板処理方法 | |
JPH09181041A (ja) | 基板処理装置 | |
JPH0749790Y2 (ja) | 半導体ウェーハの洗浄装置 | |
JP2013207207A (ja) | 基板液処理装置及び基板液処理方法 | |
JP3430611B2 (ja) | エッチング装置と濃燐酸溶液の処理方法 | |
KR20100116436A (ko) | 기판 세정 장치 및 방법 | |
JP2000153139A (ja) | オゾン水生成装置およびオゾン水を生成する方法 | |
KR100938242B1 (ko) | 약액 공급 시스템 | |
KR100683273B1 (ko) | 약액공급장치 | |
JPH10326769A (ja) | 半導体ウェーハ処理溶液の管理方法およびその制御装置 | |
JPH0715895B2 (ja) | 基板表面洗浄方法 | |
KR0160387B1 (ko) | 반도체 식각공정의 diw 추가 공급방법 및 그 장치 | |
JPS6233013Y2 (en]) | ||
JPH0629270A (ja) | 半導体基板洗浄方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |